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Test Name | EIA 364 TP | IEC 60512 TP | MIL-STD-1344 Method No. |
Mechanical() | |||
Nominal force() | 04 | none | none |
Crimp deformation (Crimp) | 07 | 16-7 | 2001 |
Crimp tensile (Crimp) | 08 | 416 | 2003 |
Durability () | 09 | 9-1 | 2016 |
Mating/Unmating (/) | 13 | 13-2 | 2013 |
Contact retention () | 29 | 15-1 | 2007 |
Engagement/Separation (/) | 37 | 6-5 | 2014 |
Vibration() | 28 | 6-4 | 2095 |
Shock () | 27 | 6-3 | 2004 |
Electrical() | |||
Contact resistance() | 06 | 2-2 | 3004 |
D W V ( ) | 20 | 4-1 | 3001 |
Insulation resistance () | 21 | 3-1 | 3003 |
LLCR () | 23 | 2-1 | 3002 |
Capacitance () | 30 | 22-1 | none |
Inductance () | 33 | none | none |
EMI() | 66 | none | 3008 |
Low-level inductance () | 69 | none | none |
Current rating() | 70 | 6-1 | none |
Current cyeling () | 55 | 9-5 | none |
Environmental() | |||
Fluid immersion () | 10 | X23 | 1016 |
Solvent resistance () | 11 | none | none |
Temperature life () | 17 | 9-2 | 1005 |
Salt spray () | 26 | 11-6 | 1001 |
Humidity () | 31 | 11-3 | 1002 |
Thermal shock () | 32 | 11-4 | 1003 |
Gas tight () | 36 | none | none |
Solderability () | 52 | 12-1 | none |
Porosity(nitric)(()) | 53 | none | 1017 |
Resistance to solder heat () | 56 | 12-4 | none |
Porosity(gen)(,) | 60 | none | none |
Mixed flowing gas (MFG,) | 65 | none | none |
Combustion () | 81 | none | none |
Corrosivity () | 82 | none | none |
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